I work in the semiconductor industry. When making very very small NAND chips there are stages in production where oxygen is damaging to the part. I work on diffusion furnaces and the loading area is purged with N2 (nitrogen) to protect the product from "native oxide." In order to work in the loading area we have to purge with "air." We have sensors that monitor the oxygen level in the loading area. The size of the loading area on an individual piece of equipment is smaller than a broom closet. Sometimes the doors do not seal completely and despite purging with around 500slm (liters per minute) we cannot get the oxygen level where we want it (below 30ppm). Anyway, long story short, oxygen can push its way into anything that is not sealed up very tight, and even then it's a lot better if you can push a lot of something else into that same space to keep the O2 out. I wonder how much CO2 comes out of an average air-lock, but I'm guessing it's no where near 500slm.