Made an IC and a sparge ring from copper over the last week. Both have fittings I sweated on that will contact the wort/water. Used lead-free flux and lead-free silver solder. When soldering these on, I made sure to try to only heat the fitting, not the pipe. Nonetheless, the pipe had some greyish-green splotching when I was done as a result of all the heat. In all cases, I sanded the hell out of the joints after I was done, and was able to remove most of this splotching, while just scratching up the solder.
Question is, by (a) scratching up the outside of the pipe so much and (b) scratching up the solder after it was set, am I now going to leech harmful stuff into my wort/mash from where the exposed, scratched surfaces contact it?
Thanks - Norm